Product Introduction
By adopting a thinner packaging structure, the product can be made lighter and thinner, with a thickness reduction of more than 60% compared to the conventional TO-263 packaging. It is suitable for customers to design smaller products and can effectively save space. It can support packaging products such as Schottky diodes, fast recovery diodes, rectifiers, silicon carbide diodes, MOS, etc. It uses environmentally friendly materials and complies with RoHS standards;
Product Features
1. Low height (typical value of 1.7mm)
2. Reduce power loss
3. High efficiency and reliability
4. Can be pin compatible with TO-263-2L package
5. Compared with TO-277 and DFN packaging, it can maximize the rated power, achieve miniaturization and space saving design.
6. Meet the MSL1 humidity sensitivity level standard